Polymer thick film (PTF) flexible
circuits are manufactured by screen-printing
conductive inks onto flexible
substrates such as PET. Parlex
can produce multilayer circuits
by further screen-printing dielectric
materials as an insulating layer.
Our proprietary through-hole technologies
also permit the use of double
sided printing to further optimize
space and assembly cost.
Parlex
is a leader in technology &
process development in Polymer
Thick Film (PTF) circuits and
assemblies. We offer a full range
of capability- including circuit
design & engineering, design
for manufacturing, circuit fabrication,
die-cutting, surface mount technology,
Flip-Chip assembly and turnkey
manufacturing. (Learn
more)
Save money and the environment
- PTF circuits
use additive printing with
silver and carbon inks and
do not generate hazardous
waste from copper etching.
The PET substrates commonly
employed are less costly
than materials traditionally
used in circuit manufacturing.
PTF circuits are RoHS compatible.
Increase component
reliability - Lighter
weight; better heat distribution
in use. Components mounted
with Parlex exclusive PolySolder®
Adhesive experience less
thermal stress in manufacture
vs. traditional SnPb flow
and do not require flux
cleaning.
Manufacturing Process
for PTF Circuits
Parlex
Polymer Thick Film Technology
(PTF) takes advantage
of high speed screen printing
techniques, as well as
ink and dielectric materials
formulated by the Parlex
Development team to provide
high-yield circuits for
your application. PTF
can support up to four
layers of circuitry, membrane
and tactile switch integration,
surface mount and through-hole
assembly using lead-free
conductive adhesives.
Medical circuits and sensors
can take advantage of
our silver/silver chloride
ink technology and medical
hydrogels. Parlex high
speed manufacturing and
assembly techniques and
the use of dedicated lean
manufacturing cells provides
an efficient source for
your PTF circuit needs.
Save money and the environment
- PTF circuits
use additive printing with
silver and carbon inks and
do not generate hazardous
waste from copper etching.
The PET substrates commonly
employed are less costly
than materials traditionally
used in circuit manufacturing.
PTF circuits are RoHS compatible.
